DocumentCode :
71995
Title :
A Bulk-Micromachined Fully Differential MEMS Accelerometer With Split Interdigitated Fingers
Author :
Aydin, Osman ; Akin, Tayfun
Author_Institution :
METU-MEMS Res. & Applic. Center, Middle East Tech. Univ., Ankara, Turkey
Volume :
13
Issue :
8
fYear :
2013
fDate :
Aug. 2013
Firstpage :
2914
Lastpage :
2921
Abstract :
This paper proposes a novel bulk-micromachined MEMS accelerometer employing split interdigitated sense fingers that provide a fully differential signal interface, where the accelerometer can be fabricated by a modified silicon-on-glass process using a silicon-on-insulator (SOI) wafer. The accelerometer combines the feasibility of fabricating large mass and high aspect ratio structures using bulk-micromachining together with the highly sensitive split interdigitated sense finger triplets that are connected with multilayer metal interconnects on an SOI-glass bonded wafer. The fabricated accelerometer is packaged for system level tests with a fourth-order Σ-Δ readout circuitry to evaluate its performance. The measurement results show that the accelerometer achieves a bias instability of 50 μg and a velocity random walk of 11.5 μg/√Hz. The accelerometer operates in a range of ±5 g with a nonlinearity of 1140 ppm.
Keywords :
accelerometers; microsensors; readout electronics; silicon-on-insulator; bulk-micromachined fully differential MEMS accelerometer; fourth-order Σ-Δ readout circuitry; fully differential signal interface; high aspect ratio structures; silicon-on-glass process; silicon-on-insulator wafer; split interdigitated sense fingers; Accelerometer; bulk-micromachining; fully-differential detection; split interdigitated fingers;
fLanguage :
English
Journal_Title :
Sensors Journal, IEEE
Publisher :
ieee
ISSN :
1530-437X
Type :
jour
DOI :
10.1109/JSEN.2013.2264667
Filename :
6518130
Link To Document :
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