DocumentCode
71995
Title
A Bulk-Micromachined Fully Differential MEMS Accelerometer With Split Interdigitated Fingers
Author
Aydin, Osman ; Akin, Tayfun
Author_Institution
METU-MEMS Res. & Applic. Center, Middle East Tech. Univ., Ankara, Turkey
Volume
13
Issue
8
fYear
2013
fDate
Aug. 2013
Firstpage
2914
Lastpage
2921
Abstract
This paper proposes a novel bulk-micromachined MEMS accelerometer employing split interdigitated sense fingers that provide a fully differential signal interface, where the accelerometer can be fabricated by a modified silicon-on-glass process using a silicon-on-insulator (SOI) wafer. The accelerometer combines the feasibility of fabricating large mass and high aspect ratio structures using bulk-micromachining together with the highly sensitive split interdigitated sense finger triplets that are connected with multilayer metal interconnects on an SOI-glass bonded wafer. The fabricated accelerometer is packaged for system level tests with a fourth-order Σ-Δ readout circuitry to evaluate its performance. The measurement results show that the accelerometer achieves a bias instability of 50 μg and a velocity random walk of 11.5 μg/√Hz. The accelerometer operates in a range of ±5 g with a nonlinearity of 1140 ppm.
Keywords
accelerometers; microsensors; readout electronics; silicon-on-insulator; bulk-micromachined fully differential MEMS accelerometer; fourth-order Σ-Δ readout circuitry; fully differential signal interface; high aspect ratio structures; silicon-on-glass process; silicon-on-insulator wafer; split interdigitated sense fingers; Accelerometer; bulk-micromachining; fully-differential detection; split interdigitated fingers;
fLanguage
English
Journal_Title
Sensors Journal, IEEE
Publisher
ieee
ISSN
1530-437X
Type
jour
DOI
10.1109/JSEN.2013.2264667
Filename
6518130
Link To Document