Title :
The field of view and resolution of marco images enhanced by modified superresolution method
Author :
Hsin-Yi Tsai ; Kuo-Cheng Huang ; Min-Wei Hung ; Chih-Chung Yang ; Ching-Ching Yang
Author_Institution :
Nat. Appl. Res. Labs., Instrum. Technol. Res. Center, Hsinchu, Taiwan
Abstract :
The properties of the image acquired from a general camera contain a large field of view (FOV) and low resolution. In contrast, the microscopy usually offers higher magnification image a smaller FOV but high resolution. This study attempts to develop a modified super resolution (MSR) method to obtain both of high resolution and large FOV properties for criminal identified microscopic images. The MSR method can analysis the image´s pixels either from the intensity of single point (ISP) or the intensity of neighbor point (INP), when a microscopic image (150X) captured under white light, and three macro images (60X) captured under three different wavelength lights (red-620nm, green-520nm and blue-460nm), and then can reconstruct a new criminal identified image with high resolution and large FOV. Finally the simulated experiments in an ant model show that, the ISP analysis offers a reconstructed image with higher contrast and identification degree, synchronously the INP analysis affords an image has smoother edge.
Keywords :
cameras; image enhancement; image reconstruction; image resolution; FOV; INP analysis; ISP analysis; MSR method; camera; criminal identified microscopic imaging; field of view; image acquisition; image reconstruction; intensity of neighbor point analysis; intensity of single point analysis; marcoimage enhancement; marcoimage resolution; microscopic imaging; modified superresolution method; wavelength 460 nm; wavelength 520 nm; wavelength 620 nm; Cameras; Image edge detection; Image reconstruction; Image resolution; Lenses; Microscopy; LED light; criminal identification; microscopic image; super resolution (SR) technology;
Conference_Titel :
Instrumentation and Measurement Technology Conference (I2MTC), 2015 IEEE International
Conference_Location :
Pisa
DOI :
10.1109/I2MTC.2015.7151423