Dual thermal time constant electrothermal modeling of PIN diode protection circuits

Author

Caverly, Robert H.

Author_Institution

ECE Dept., Villanova Univ., Villanova, PA, USA

fYear

2015

fDate

25-28 Jan. 2015

Firstpage

1

Lastpage

3

Abstract

A study of the temperature change in PIN diode protection circuits is presented using a dual time constant thermal model with a magnetic resonance (MR) imaging receive coil as the application. Simulations using the model show dual time constant behavior with a rapid temperature rise and corresponding cool off in the PIN diode with application and removal of an MR transmit pulse and for low duty cycle MR pulse sequences. This new electrothermal model allows MR coil designers the ability to include packaging and mounting thermal properties as part of their coil design.

Keywords

coils; magnetic resonance imaging; p-i-n diodes; thermal management (packaging); thermal resistance; MR imaging receive coil; MR transmit pulse removal; PIN diode protection circuits; dual time constant behavior; dual time constant thermal model; electrothermal model; low duty cycle MR pulse sequences; magnetic resonance imaging receive coil; packaging; temperature change; thermal properties; Electronic packaging thermal management; Integrated circuit modeling; Magnetic resonance imaging; PIN photodiodes; Radio frequency; Temperature measurement; Thermal resistance; electrothermal effects; magnetic resonance imaging; p-i-n diodes; thermal management of electronics; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Biomedical Wireless Technologies, Networks, and Sensing Systems (BioWireleSS), 2015 IEEE Topical Conference on

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/BIOWIRELESS.2015.7152118

Filename

7152118