DocumentCode :
720566
Title :
High Dynamic Range Saturation Intelligence Avoidance for Three-Dimensional Shape Measurement
Author :
Bin Zhang ; Yuanxin Ouyang ; Shuo Zhang
Author_Institution :
State Key Lab. of Software Dev. Environ., Beihang Univ., Beijing, China
fYear :
2015
fDate :
4-7 May 2015
Firstpage :
981
Lastpage :
990
Abstract :
There always exists an intractable challenge in three-dimensional (3D) object surface measurement that it is difficult to deal with the scene with a large range reflectivity or specular reflection. This paper presents a novel 3D measurement technique: high dynamic range saturation intelligence avoidance (HDRSIA), which is based on the multi-exposure principle. This method divides the object surface into several parts according to the color distribution and leverages the modified curve fitting technique to capture the best exposure time for each part, intelligently and precisely. A set of modified fringe images are then composite to a complete image contained the information of brightness part and darkness part. Experiment results verify that the proposed method can build the accurate 3D point cloud model for object surface with high dynamic range of surface reflectivity variation.
Keywords :
curve fitting; image colour analysis; image fusion; shape measurement; 3D object surface measurement; 3D point cloud model; HDRSIA; brightness part; color distribution; darkness part; exposure time; high-dynamic range saturation intelligence avoidance; modified curve fitting technique; modified fringe images; multiexposure principle; object surface; range reflectivity; specular reflection; surface reflectivity variation; three-dimensional object surface measurement; Cameras; Dynamic range; Hardware; Image color analysis; Phase measurement; Shape measurement; Three-dimensional displays; 3D measurement; high dynamic range; image fusion; intelligence; modified curve fitting;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Cluster, Cloud and Grid Computing (CCGrid), 2015 15th IEEE/ACM International Symposium on
Conference_Location :
Shenzhen
Type :
conf
DOI :
10.1109/CCGrid.2015.100
Filename :
7152584
Link To Document :
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