DocumentCode :
720779
Title :
The solution to enhance i-line stepper applications by improviing process overlay accuracy
Author :
Sumiyoshi, Atsushi Shigenobu Yuhei ; Sasaki, Ryo ; Hasegawa, Yasuo ; Ushiku, Kentaro ; Sano, Hirotaka ; Takeshita, Bunsuke ; Miura, Seiya
Author_Institution :
Canon Inc., Utsunomiya, Japan
fYear :
2015
fDate :
15-16 March 2015
Firstpage :
1
Lastpage :
3
Abstract :
Canon has developed the world´s first stepper with the shot shape compensator called “SSC”, which independently controls x and y magnification of shots on a wafer. This SSC function enables steppers to achieve overlay accuracy equivalent to scanners. The most suitable application of this function is back side illumination (BSI) image sensors, which has large distortion on wafers because of bonding and thinning processes. In this paper, we will provide the detailed descriptions along with the exposure results using our new solutions.
Keywords :
bonding processes; image sensors; semiconductor device manufacture; wafer bonding; back side illumination image sensors; i-line stepper applications; process overlay accuracy; shot shape compensator; Accuracy; Adaptive optics; Decision support systems; Distortion measurement; Optical distortion; Optical imaging; Optical sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
ISSN :
2158-2297
Type :
conf
DOI :
10.1109/CSTIC.2015.7153370
Filename :
7153370
Link To Document :
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