Stress control on plasma resistant ceramic coating

Chamber components inside plasma etching tools suffer the erosion of halogen plasma. Advanced ceramics, such as Al₂O₃, Y₂O₃ and etc., are often used as plasma resistant materials. In this study, 2um high density ceramic coating was prepared on Si by the plasma deposition. The influence of four parameters on the structure stability was systematically studied and a 300MPa of stress variation window was identified by orthogonal tests. The results from the experiments can be used to develop the structure stabilized ceramic coating for plasma etch chambers.