Finite element simulation for FPCB curing process

The curing process of flip chip (FC) on flexible printed circuit boards (FPCB) was introduced. The structure of equipment was analyzed. The possible effect of equipment structure was evaluated. Different finite element analysis (FEA) models in different situations were built. Thermal influence parameters were verified for curing process by comparing FEA models and actual products. The parameters of transient FEA were defined after further analysis and were verified by use of transient FEA. The result of transient finite element simulation provided the theoretical evidence for the transient parameters setting. By comparing with actual parameters and the FEA results, curing process and optimized parameters by finite element thermal simulation were validated successfully.