DocumentCode :
720861
Title :
Glass phase alignment in front side pastes for P- and N-type solar cells
Author :
Eberstein, Markus ; Reinhardt, Kathrin ; Korner, Stefan ; Kiefer, Fabian ; Peibst, Robby
Author_Institution :
Fraunhofer IKTS, Dresden, Germany
fYear :
2015
fDate :
15-16 March 2015
Firstpage :
1
Lastpage :
5
Abstract :
Using an in-situ contact resistance measurement silver pastes containing glass and aluminum additions for p- and n-type cells were investigated during rapid thermal process (RTP) firing. The glass viscosity, i.e. the formation of a liquid phase having a viscosity between 104 Pa·s and 105 Pa·s, is the crucial point for opening of the antireflection coating, regardless of the kind of wafer or aluminum addition. The maximum efficiency is obtained in an optimum between the competing effects silver precipitation and emitter corrosion and can be precisely time-resolved observed by an in-situ contact resistance measurement. The peak firing temperature determines the intensity of the interface reaction whereas the temperature related glass viscosity is crucial important for the reaction duration and acts as kinetic switch. In comparison to common pastes for p-type cells, in pastes with alumina additions for n-type cells the glass phase rearranges and depletes at the interface due to thermodynamic reasons. The rearrangement of the glass phase attenuates the reduction of silver in the interface layer and controls the solar cell contacting.
Keywords :
antireflection coatings; contact resistance; solar cells; viscosity; RTP firing; antireflection coating; emitter corrosion; front side paste; glass phase alignment; glass viscosity; in-situ contact resistance measurement; kinetic switch; n-type solar cell; p-type solar cell; peak firing temperature; rapid thermal process; silver precipitation; Aluminum; Apertures; Ceramics; Force; Silver; Standards;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Technology International Conference (CSTIC), 2015 China
Conference_Location :
Shanghai
ISSN :
2158-2297
Type :
conf
DOI :
10.1109/CSTIC.2015.7153489
Filename :
7153489
Link To Document :
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