Title :
Multi-field modulation of exchange biased FeGa/IrMn bilayers grown on flexible polyvinylidene fluoride (PVDF) membranes
Author :
Li, H. ; Zhan, Q. ; Rong, X. ; Liu, Y. ; Zhenghu, Z. ; Yang, H. ; Xiaoshan, Z. ; Wang, B. ; Mao, S. ; Li, R.
Author_Institution :
Key Lab. of Magn. Mater. & Devices & Zhejiang Province Key Lab. of Magn. Mater. & Applic. Technol., Ningbo Inst. of Mater. Technol. & Eng., Ningbo, China
Abstract :
Exchange bias (EB) effect has been widely applied in magnetoelectronic devices such as magnetic tunneling junctions and spin valve sensors. Nowadays, the EB related flexible magnetic multilayers have found their application in wearable electronics, which are stretchable and bendable, and hence are closely strain related [1, 2]. Therefore, the investigation on the strain-mediated multi-field control of magnetism in the EB bilayers is of great significance for the development of flexible mag-netoelectronic devices [3]. In this study, we utilized flexible ferroelectric polyvinylidene fluoride (PVDF) membranes to improve the efficiency of strain transfer from substrate to EB heterostructure, and studied the thermal deformation and electric field control of the magnetic behaviors of FeGa/IrMn heterostructures.
Keywords :
coercive force; ferroelectric materials; gallium alloys; iridium alloys; iron alloys; magnetic multilayers; magnetic thin films; magnetic tunnelling; magnetoelectronics; manganese alloys; membranes; metallic thin films; polymer blends; spin valves; EB related flexible magnetic multilayers; FeGa-IrMn; electric field control; exchange bias effect; exchange biased bilayers; flexible ferroelectric polyvinylidene fluoride membranes; flexible magnetoelectronic devices; heterostructures; magnetic tunneling junctions; magnetoelectronic devices; multifield modulation; spin valve sensors; strain-mediated multifield control; thermal deformation; wearable electronics; Coercive force; Electric fields; Magnetic field measurement; Magnetic multilayers; Magnetic tunneling; Magnetoelectronics; Temperature measurement;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7156538
