Title :
Current distribution analysis for a multilayer high-Tc superconducting cable considering magnetic hysteresis
Author :
Xu, W. ; Duan, N. ; Wang, S. ; Zhu, J. ; Guo, Y.
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
Abstract :
This paper presents a new Preisach type hysteresis model for the high temperature superconductor. This model requires only the limiting hysteresis loop as the input data, and for this model, the limiting hysteresis loop is firstly separated into two limiting M-H loops based on the mechanisms, which can then be modeled by two separate modified Preisach algorithms. The area integrations of the Preisach distribution functions are determined only based on the limiting M-H loops. The nonlinear dynamic circuit model of the superconductor is established. In the circuit model, the hysteresis inductance and hysteresis loss described by using the new Preisach type model are deduced. Applying the hysteresis circuit model, the currents flowing in different superconductor layers of high temperature superconducting (HTS) cable are simulated, as well as the hysteresis loss of the superconducting cable. The simulation results are verified by comparison with the data recorded in literatures. Finally, the influences of hysteresis on superconducting cable are analyzed and discussed.
Keywords :
high-temperature superconductors; magnetic hysteresis; magnetic multilayers; superconducting cables; Preisach distribution functions; Preisach type hysteresis model; area integrations; current distribution analysis; hysteresis circuit model; hysteresis inductance; hysteresis loss; input data; limiting M-H loops; limiting hysteresis loop; magnetic hysteresis; modified Preisach algorithms; multilayer high temperature superconducting cable; nonlinear dynamic circuit model; High-temperature superconductors; Integrated circuit modeling; Limiting; Magnetic hysteresis; Mathematical model; Power cables; Superconducting cables;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7156961