Title :
Stress-annealing induced anisotropy in FeCrCuNbSiB nanocrystalline wires
Author :
Li, Y. ; Liu, P. ; Vazquez, M.
Author_Institution :
Lab. of Electromagn. Transp. Mater., Xingtai Univ., Xingtai, China
Abstract :
After suitable annealing, amorphous alloy with composition of FeCuNbSiB (Finemet) exhibits excellent soft magnetic properties owing to the nanocrystallization. When the amorphous alloy was annealed under application of mechanical stress, a transverse anisotropy of the order of 103 J/m3 had been found in the nanocrystalline alloy. During the annealing process, with an axially applied tensile stress, the nanocrystalline bcc Fe-Si grains (magnetostriction ls <; 0) take the form of ellipsoid with the short axis parallel to the axis of samples due to the magneto-elastic interaction in the interface of two-phases. Since the load is still applied in the process of cooling, this microstructure can be reserved in the stress-annealed samples. In this work, the stress-annealing induced anisotropy of Cr-doped Finemet nanocrystalline wires is studied, especially, an anomalous stress-dependent induced anisotropy is reported.
Keywords :
amorphous magnetic materials; annealing; boron alloys; chromium alloys; cooling; copper alloys; crystal microstructure; crystallisation; induced anisotropy (magnetic); iron alloys; magnetoelastic effects; nanofabrication; nanomagnetics; nanostructured materials; niobium alloys; silicon alloys; soft magnetic materials; Cr-doped Finemet nanocrystalline wires; FeCrCuNbSiB; FeCrCuNbSiB nanocrystalline wires; amorphous alloy; anomalous stress-dependent induced anisotropy; axially applied tensile stress; cooling process; magnetoelastic interaction; mechanical stress; microstructure; nanocrystalline alloy; nanocrystalline bcc Fe-Si grains; nanocrystallization; soft magnetic properties; stress-annealing induced anisotropy; transverse anisotropy; two-phase interface; Anisotropic magnetoresistance; Annealing; Magnetic anisotropy; Magnetostriction; Metals; Stress; Wires;
Conference_Titel :
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-7321-7
DOI :
10.1109/INTMAG.2015.7157152