DocumentCode
722212
Title
L10 -ordered MnAl thin films with high perpendicular magnetic anisotropy using tin underlayers on Si substrates
Author
Huang, E.Y. ; Kryder, M.H.
Author_Institution
Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2015
fDate
11-15 May 2015
Firstpage
1
Lastpage
1
Abstract
Ferromagnetic L10-ordered τ-phase MnAl thin films have been shown to exhibit high perpendicular magnetic anisotropy (Ku > 107 ergs/cm3), moderate saturation magnetization (M <; 600 emu/cm3), and low Gilbert damping parameter (α = 0.006). x-MnAl is also rare earth- and precious metal-free, making it an attractive candidate for a variety of applications such as magnetic recording, nonvolatile memory technologies, spintronic devices, permanent magnets, etc. However, achieving the necessary L10-ordering for perpendicular anisotropy in MnAl thin films has proven challenging and highly sensitive to deposition conditions and underlayers used. Using MgO underlayers, we previously demonstrated MnAl thin films with high perpendicular magnetic anisotropy (PMA) on Si substrates for the first time. However, MgO is an insulator, which presents two major challenges. First, MgO must be RF-sputtered, which results in low deposition rates, re-sputtering, and therefore the potential for MgO contamination in undesirable locations. Second, since it is an insulator, MgO impedes the use of MnAl film stacks as the bottom electrode in a magnetic tunnel junction (MTJ) for spintronic applications.
Keywords
aluminium alloys; interface magnetism; magnetic hysteresis; magnetic thin films; manganese alloys; metallic thin films; perpendicular magnetic anisotropy; titanium compounds; Gilbert damping parameter; MnAl-TiN; Si; Si substrates; ferromagnetic L10-ordered τ-phase thin films; perpendicular magnetic anisotropy; saturation magnetization; underlayers; Fabrication; Films; Magnetic tunneling; Saturation magnetization; Silicon; Substrates; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4799-7321-7
Type
conf
DOI
10.1109/INTMAG.2015.7157550
Filename
7157550
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