• DocumentCode
    722283
  • Title

    Co-ferrite thin films with perpendicular magnetic anisotropy

  • Author

    Liu, X. ; Shirsath, S.E. ; Shindoh, K.

  • Author_Institution
    Dept. of Inf. Eng., Shinshu Univ., Nagano, Japan
  • fYear
    2015
  • fDate
    11-15 May 2015
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Here, a unique process has been developed to deposit Co-ferrite thin films onto thermally oxidized silicon wafer with perpendicular magnetic anisotropy by facing target sputtering. Co-ferrite films with preferential (001) orientation have been successfully prepared. Coercivity in the perpendicular direction as large as 12 kOe has been achieved. Of particular interest is that the perpendicular magnetic anisotropy and coercivity of the films are depended on the chemical status in the films. Three dimensional lattice parameters determined by in-plane X-ray diffractometry to be a=b=8 .43 Å, c = 8 . 35Å. This indicating a compressive out-of-plane strain as large as 1 .1 %.
  • Keywords
    X-ray diffraction; cobalt compounds; coercive force; ferrites; lattice constants; magnetic thin films; perpendicular magnetic anisotropy; sputter deposition; Co-ferrite thin films; CoFe2O4; SiO2-Si; coercivity; compressive out-of-plane strain; facing target sputtering; in-plane X-ray diffractometry; perpendicular direction; perpendicular magnetic anisotropy; preferential (001) orientation; thermally oxidized silicon wafer; three-dimensional lattice parameters; Coercive force; Films; Lattices; Perpendicular magnetic anisotropy; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Magnetics Conference (INTERMAG), 2015 IEEE
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7321-7
  • Type

    conf

  • DOI
    10.1109/INTMAG.2015.7157642
  • Filename
    7157642