DocumentCode
722283
Title
Co-ferrite thin films with perpendicular magnetic anisotropy
Author
Liu, X. ; Shirsath, S.E. ; Shindoh, K.
Author_Institution
Dept. of Inf. Eng., Shinshu Univ., Nagano, Japan
fYear
2015
fDate
11-15 May 2015
Firstpage
1
Lastpage
1
Abstract
Here, a unique process has been developed to deposit Co-ferrite thin films onto thermally oxidized silicon wafer with perpendicular magnetic anisotropy by facing target sputtering. Co-ferrite films with preferential (001) orientation have been successfully prepared. Coercivity in the perpendicular direction as large as 12 kOe has been achieved. Of particular interest is that the perpendicular magnetic anisotropy and coercivity of the films are depended on the chemical status in the films. Three dimensional lattice parameters determined by in-plane X-ray diffractometry to be a=b=8 .43 Å, c = 8 . 35Å. This indicating a compressive out-of-plane strain as large as 1 .1 %.
Keywords
X-ray diffraction; cobalt compounds; coercive force; ferrites; lattice constants; magnetic thin films; perpendicular magnetic anisotropy; sputter deposition; Co-ferrite thin films; CoFe2O4; SiO2-Si; coercivity; compressive out-of-plane strain; facing target sputtering; in-plane X-ray diffractometry; perpendicular direction; perpendicular magnetic anisotropy; preferential (001) orientation; thermally oxidized silicon wafer; three-dimensional lattice parameters; Coercive force; Films; Lattices; Perpendicular magnetic anisotropy; Silicon; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Magnetics Conference (INTERMAG), 2015 IEEE
Conference_Location
Beijing
Print_ISBN
978-1-4799-7321-7
Type
conf
DOI
10.1109/INTMAG.2015.7157642
Filename
7157642
Link To Document