DocumentCode :
72277
Title :
Welcome to EMBC 2013 in Osaka [Guest Editorial]
Author :
Sunagawa, K.
Volume :
4
Issue :
3
fYear :
2013
fDate :
May-13
Firstpage :
10
Lastpage :
10
Abstract :
Presents an opening message from the 2013 IEEE Engineering in Medicine and Biology Conference that will be held in Osaka, Japan.
Keywords :
Biomedical engineering; Meetings; Special issues and sections;
fLanguage :
English
Journal_Title :
Pulse, IEEE
Publisher :
ieee
ISSN :
2154-2287
Type :
jour
DOI :
10.1109/MPUL.2013.2250839
Filename :
6518156
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=72277
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