• DocumentCode
    722861
  • Title

    A novel energy-efficient data acquisition method for wearable devices

  • Author

    Takeda, Akira ; Yokosawa, Akira ; Sano, Shintaro ; Sasaki, Shunsuke ; Kodaka, Takeshi ; Tokuyoshi, Takahiro ; Kizu, Toshiki

  • Author_Institution
    Center for Semicond. R&D, Toshiba Corp., Kawasaki, Japan
  • fYear
    2015
  • fDate
    13-15 April 2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    On wearable devices where an MCU primarily remains in an idle state, keeping the MCU in a deep sleep mode during idle periods can lead to significant power reduction. Since the deep sleep mode has a relatively high wake-up overhead, one of the effective techniques for power reduction is to decrease the wake-up frequency of the MCU. Meanwhile, due to the recent trend of increasing the number of sensors embedded in wearable devices, the MCU must wake up more frequently for data acquisitions from the sensors. This indicates an increase in power consumption caused by frequent wakeups. In this paper, we propose a new method to achieve power reduction of the MCU for wearable applications. The applications acquire data periodically from multiple sensors. Our proposed method achieves low power consumption by gathering the scattered data acquisitions of the sensors and decreasing the wake-up frequency. The experimental result shows that the proposed method achieved an 8.5-31% power reduction in the MCU.
  • Keywords
    data acquisition; electric sensing devices; low-power electronics; microcontrollers; MCU; deep sleep mode; energy-efficient data acquisition; low power consumption; microcontroller unit; multiple sensors; power reduction; scattered data acquisitions; wake-up frequency; wake-up overhead; wearable devices; Batteries; Companies; Data acquisition; Power demand; Registers; Sensors; Software; MCU; deep sleep mode; low power; sensor; wearable;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low-Power and High-Speed Chips (COOL CHIPS XVIII), 2015 IEEE Symposium in
  • Conference_Location
    Yokohama
  • Type

    conf

  • DOI
    10.1109/CoolChips.2015.7158662
  • Filename
    7158662