Title :
Temperature-aware power distribution network designs for 3D ICs and systems
Author :
Sung Joo Park ; Swaminathan, Madhavan
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Many recent problems related to integrated circuits have been solved by three-dimensional integration using throughsilicon vias. This technique presents some thermal-related issues related to high thermal density. In this work, we estimate the effects of temperature on power distribution networks consisting of a printed circuit board, an interposer, and stacked dies connected by through-silicon vias. The model we built has various on- and off-chip decoupling capacitors, so this paper analyzes the effects of temperature on power delivery network impedance and power ground noise using temperature-aware simulations. The results indicate that a high temperature density system requires both temperature-aware simulation and design. Based on further simulations with practical cases, this paper also presents an efficient power delivery network design method for three-dimensional systems consisting of various types of decoupling capacitors and heterogeneous dies.
Keywords :
capacitors; elemental semiconductors; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; printed circuit design; silicon; thermal analysis; three-dimensional integrated circuits; 3D IC; Si; heterogeneous dies; high temperature density system; integrated circuits; interposer; off-chip decoupling capacitors; on-chip decoupling capacitors; power delivery network design; power delivery network impedance; power ground noise; printed circuit board; stacked dies; temperature-aware power distribution network designs; temperature-aware simulations; thermal density; three-dimensional integration; three-dimensional systems; through silicon vias; Capacitance; Capacitors; Impedance; Resistance; System-on-chip; Temperature dependence; Three-dimensional displays;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159672
