DocumentCode :
723114
Title :
Investigation of modulation-capable silicon waveguides for efficient on-wafer terahertz interconnects
Author :
Myers, Joshua C. ; Kaur, Amanpreet ; Byford, Jennifer A. ; Chahal, Premjeet
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
1010
Lastpage :
1016
Abstract :
In this paper, silicon-based waveguides are investigated for on-wafer THz interconnect applications. A silicon based dielectric ribbon and ridge waveguide are both shown through HFSS modeling and simulation to have very low-loss transmission characteristics as low as .3dB/mm in the THz frequency spectrum. In addition, the modulation properties of both waveguides are investigated through a Drude model analysis as well as EM simulation. Several silicon ridge waveguide samples are fabricated using a simple silicon wet-etching technique. These waveguides are shown to efficiently transmit THz radiation, especially when the ridge is narrow. The low-loss nature of these waveguides shows the potential of silicon-based interconnects with built-in modulation capabilities for THz integrated circuit applications.
Keywords :
dielectric materials; etching; interconnections; modulation; ridge waveguides; silicon; terahertz waves; Drude model analysis; EM simulation; HFSS modeling; THz frequency spectrum; THz integrated circuit; THz radiation; built-in modulation capability; dielectric ribbon; low-loss transmission characteristic; modulation property; modulation-capable silicon waveguide; on-wafer terahertz interconnect; silicon ridge waveguide; silicon wet-etching technique; Conductivity; Dielectric losses; Modulation; Optical waveguides; Permittivity; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159719
Filename :
7159719
Link To Document :
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