All solid-state multi-chip multi-channel WDM photonic module

Author

Shubin, I. ; Zheng, X. ; Thacker, H. ; Djordjevic, S.S. ; Lin, S. ; Amberg, P. ; Lexau, J. ; Raj, K. ; Cunningham, J.E. ; Krishnamoorthy, A.V.

Author_Institution

Oracle, San Diego, CA, USA

fYear

2015

fDate

26-29 May 2015

Firstpage

1293

Lastpage

1298

Abstract

In this work we report on a packaged prototype of a WDM photonic transceiver. It is a hybrid assembly based on a 130 nm SOI photonic circuitry integrated with a 40 nm CMOS VLSI driver. Our prototype supports eight tunable WDM channels operating at 10 Gb/s each capable of both transmitting and receiving data on the same chip. We discuss two options to close the link while using the optical fiber or another waveguide bridge chip. We provide hybridization details and supporting link measurement data to describe packaged photonic module and its power efficient functionality as its on-chip power per channel averaged 1.3pJ/bit, laser electrical power excluded.

Keywords

CMOS integrated circuits; integrated optics; multichip modules; optical transceivers; wavelength division multiplexing; CMOS VLSI driver; SOI photonic circuitry; WDM photonic transceiver; bit rate 10 Gbit/s; hybrid assembly; link measurement data; optical fiber; packaged photonic module; size 130 nm; size 40 nm; solid-state multichip multichannel WDM photonic module; tunable WDM channels; waveguide bridge chip; Couplers; Optical fibers; Photonics; Silicon; Very large scale integration; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/ECTC.2015.7159764

Filename

7159764