Title :
Demonstration of a novel low cost single material temporary bond solution for high topography substrates based on a mechanical wafer debonding and innovative adhesive removal
Author :
Phommahaxay, Alain ; Nakamura, Atsushi ; Jourdain, Anne ; Verbinnen, Greet ; Kamochi, Yoshitaka ; Koyama, Ichiro ; Iwai, Yu ; Sawano, Mitsuru ; Tan, Shiro ; Miller, A. ; Beyer, Gerald ; Sleeckx, E. ; Beyne, Eric
Author_Institution :
Imec, Leuven, Belgium
Abstract :
Among the technological developments pushed by the emergence of 3D-ICs, wafer thinning has become a key element in device processing over the past years. As technology matures, more emphasis is now being put on the overall cost of ownership, which is still regarded as a refraining element for technology adoption. Therefore novel temporary bond concepts and materials are being explored to further bring down the process complexity and cost.
Keywords :
adhesives; three-dimensional integrated circuits; wafer bonding; 3D-IC; device processing; high topography substrate; innovative adhesive removal; mechanical wafer debonding; single material temporary bond; three-dimensional integrate circuit; Bonding; Chemicals; Inspection; Silicon; Solvents; Substrates; Surfaces;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159785