Effect of elevated testing temperature on Sn-Ag-Cu interconnect high and low G board level mechanical shock performance

The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous challenge since the material was applied to the industry. With higher functionality and smaller body size component trend, the function temperature of the component and device increased. Since most of the shock performance data were produced at room temperature, the effect of elevated temperature becomes an interest to assure the reliability of the device in mechanical shock environment. In this study, the effect of elevated temperature on high and low G mechanical shock performance on FBGA and FCBGA components were investigated. With a heating element embedded printed circuit board and silicon die, a test temperature from room temperature to 100°C was established. Shock performance were degraded or improved based on test temperature variation, component type and different failure mechanisms. The failure mode and potential failure mechanisms per condition are discussed based on each design configuration and test condition differences.