• DocumentCode
    723234
  • Title

    Investigation of high frequency characteristics of Ag-based wirebonds

  • Author

    Lih-Tyng Hwang ; Chang-Yi Feng ; Hui-Chu Chang

  • Author_Institution
    Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    2102
  • Lastpage
    2107
  • Abstract
    In this paper, high frequency characteristics of Ag alloys, for example, Ag-Au-Pd and Ag-Pd, were studied. At 20°C, the electrical resistivity of pure Ag, Au, and Pd is 1.587 μΩ·cm, 2.214 μΩ·cm, and 10.54 μΩ·cm, respectively. Depending on the metallurgical distribution of Pd in the Ag-Au alloy or Ag alloy wire bonds, the high frequency behaviors of the wire bond could vary drastically. For example, if Pd is distributed mainly on the surface, the surface impedance of the Ag-alloy wire bond could be drastically increased as the frequency is increased. Agilent´s Vector Network Analyzer (VNA) was used to obtain the S-parameters up to 67 GHz, well beyond the first resonance frequency. R, L, and C were extracted by converting the measured S-parameters. To our knowledge, this paper could well be the first one to report the effects of Pd distribution on the RF characteristics (due to the skin effect) of the Pd coated/doped Ag alloy wire bonds. Analyzing the high frequency characteristics along with reliability assessment of Pd coated/doped Ag-alloys (such as cross-sectional micrographs), an optimized Ag-based wirebond can be picked.
  • Keywords
    alloys; electrical resistivity; integrated circuit bonding; integrated circuit interconnections; lead bonding; silver; skin effect; Ag; Ag-based wirebonds; Agilent vector network analyzer; S-parameters; VNA; electrical resistivity; metallurgical distribution; skin effect; temperature 20 degC; Capacitance; Inductance; Metals; Radio frequency; Resistance; Resonant frequency; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159892
  • Filename
    7159892