• DocumentCode
    723240
  • Title

    A low-cost fabrication route for silicon microchannels and microgratings with flow-enabled polymer self-assembly patterning and wet etching

  • Author

    Liyi Li ; Bo Li ; Zhiqun Lin ; Ching-Ping Wong

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    2149
  • Lastpage
    2154
  • Abstract
    Microchannels and microgratings on silicon (Si) are key components for microfluidic device, microelectromechanical system, Si photonics, micro-chemical reactor, micro-biomedical devices and other applications. In the fabrication flow of these microstructures, photolithography and dry etching are the two major steps. However, both of them incur high fabrication cost. In this paper, we introduce a novel approach for fabrication of Si microstructures. The approach uses flow-enabled polymer self-assembly (FESA) as a facile pattern formation method on Si surface; a novel wet etching method, named metal-assisted chemical etching, is employed for Si etching. These two consecutive steps show good compatibility with each other and capability of uniform microstructures fabrication on Si. The proposed approach, with combination of two low-cost yet high-performance novel technology, will serve as a promising route for microchannels and microgratings fabrication for various Si-related devices in high-volume production.
  • Keywords
    etching; microchannel flow; polymers; self-assembly; FESA; Si; Si photonics; dry etching; fabrication route; flow-enabled polymer self-assembly patterning; metal-assisted chemical etching; microbiomedical devices; microchemical reactor; microelectromechanical system; microfluidic device; microgratings fabrication; pattern formation method; photolithography; silicon microchannels; wet etching method; Chemicals; Etching; Fabrication; Lithography; Microchannels; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159900
  • Filename
    7159900