Foreword

DTIP´2015 will be the 17^th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. In these three days, all aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in: • Nine regular sessions, • One special Session on “Co-design for MEMS based Smart Systems”, • Four poster introduction sessions, • Two poster presentation sessions, • Three invited talks.