• DocumentCode
    723515
  • Title

    A novel multiple-shell vibratory ring gyroscope

  • Author

    Abdul-Wahed, Ahmed M. ; Mahmoud, Mohamed A. E.

  • Author_Institution
    Electron. & Commun. Eng. Dept., Ain Shams Univ., Cairo, Egypt
  • fYear
    2015
  • fDate
    27-30 April 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents the design of a novel multiple-shell vibratory ring gyroscope with increased capacitance for actuation and detection. The multiple shell ring gyroscope is formed as several concentering cylindrical shells with enough space between them to place electrodes in the middle. The structure yields in-plane degenerate flexural modes that are utilized to sense rotation along the normal axis. A sample of the new gyroscope was designed and simulated by finite element analysis. The performance of the new design was compared to the traditional single shell gyroscope. Multiple-shells enable larger resonant mass, which reduces the mechanical noise floor of the sensor. The increased electrode area helps lower the actuation voltages and enhance the pick off signal. The design was implemented using SOI-MUMPs technology, and practical verification of the proposed design will be published in an upcoming work.
  • Keywords
    capacitance; electrodes; electrostatic actuators; finite element analysis; gyroscopes; shells (structures); silicon-on-insulator; SOI-MUMP technology; capacitance; cylindrical shell; electrode; electrostatic actuation; finite element analysis; inplane degenerate flexural mode; microelectromechanical system; multiple-shell vibratory ring gyroscope; resonant mass; sensor mechanical noise floor; silicon-on-insulator multiuser MEMS process; Capacitance; Damping; Electrodes; Films; Gyroscopes; Micromechanical devices; Silicon; SOI; capacitive sensing; electrostatic actuation; high performance; inertial sensors; multiple shell; noise floor; vibratory ring gyroscope;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
  • Conference_Location
    Montpellier
  • Print_ISBN
    978-1-4799-8627-9
  • Type

    conf

  • DOI
    10.1109/DTIP.2015.7160962
  • Filename
    7160962