SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications

Author

Cenni, Fabio ; Guillaume, Olivier ; Diaz-Nava, Mario ; Maehne, Torsten

Author_Institution

STMicroelectron. (Grenoble) SAS, Grenoble, France

fYear

2015

fDate

27-30 April 2015

Firstpage

1

Lastpage

6

Abstract

This paper aims at providing guidelines to select the right modeling style for MEMS simulation in order to perform system analysis. This paper presents how an application with micro-electro-mechanical system (MEMS) sensors controlled by software can be modeled and simulated at high abstraction level. The overall modeling and simulation methodology lies on the extensions of SystemC named SystemC AMS/MDVP. In order to illustrate our approach, a case study is presented which integrate three-axis MEMS containing an accelerometer, a gyroscope, a magnetometer, and its associated CPU. A special focus is put on the MEMS gyroscope.

Keywords

accelerometers; electronic design automation; gyroscopes; magnetometers; microsensors; virtual prototyping; MDVP-based model; MEMS gyroscope; MEMS sensor; MEMS simulation; SystemC-AMS-based model; accelerometer; high abstraction level; magnetometer; microelectromechanical system; three-axis MEMS; virtual prototyping; Data models; Gyroscopes; Integrated circuit modeling; Mathematical model; Micromechanical devices; Registers; Sensors; Micro-Electro-Mechanical System (MEMS); Multi-Domain Virtual Prototyping (MDVP); SystemC AMS; Timed Data Flow (TDF); Transaction-Level Modeling (TLM); block diagram; bond graph; dimensional analysis; finite element analysis; reduced-order modeling; software validation; virtual prototyping;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on

Conference_Location

Montpellier

Print_ISBN

978-1-4799-8627-9

Type

conf

DOI

10.1109/DTIP.2015.7160972

Filename

7160972