DocumentCode :
723536
Title :
Detecting response of square and circular Si/AlN/Al membranes transducers by Laser Vibrometry Doppler and Impedancemeter
Author :
Herth, Etienne ; Lardet-Vieudrin, Franck ; Valbin, Laurie ; Algre, Emmanuelle
Author_Institution :
FEMTO-ST, Univ. de Franche Comte, Besancon, France
fYear :
2015
fDate :
27-30 April 2015
Firstpage :
1
Lastpage :
5
Abstract :
This paper investigates the vibration analysis of square and circular piezoelectric micro-transducers in the hundred kHz range as a function of experimental tools. These micro-transducers have been actuated by a piezoelectric Aluminum Nitride (AlN) 0.9 μm-thin layer sandwiched between N-doped Silicon (Si) 20μm-thick layer and aluminum (Al) 0.4μm-thin layer. Si/AlN/Al square and circular membranes, with size fixed to 1.5 mm were fabricated using micromachining technology. Analytical and 3D finite element method (3D-FEM) analysis using Comsol software has been performed to model static, modal and vibration behavior of these membranes. Typical numerical simulations and experimental results are presented and discussed. Comparison with standard impedancemeter measurement is shown to assess the performance of Laser Doppler Vibrometry (LDV) system. This work´s main contribution is mechanical and electrical characterization and comparison with a model.
Keywords :
aluminium compounds; electric impedance measurement; finite element analysis; micromachining; microsensors; piezoelectric transducers; silicon; vibration measurement; 3D finite element method; 3D-FEM analysis; AlN; Comsol software; Si; circular membranes transducers; circular piezoelectric microtransducer; impedancemeter measurement; laser vibrometry doppler; micromachining technology; piezoelectric aluminum nitride; size 0.4 mum; size 0.9 mum; size 1.55 mm; size 20 mum; square membranes transducers; square piezoelectric microtransducer; vibration analysis; Computational modeling; Displacement measurement; Films; Frequency measurement; Lead; Micromachining; Q measurement; AlN thin film; Aliminum nitride; Laser Vibrometry Doppler; Micro-transducers; piezoelectric film;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on
Conference_Location :
Montpellier
Print_ISBN :
978-1-4799-8627-9
Type :
conf
DOI :
10.1109/DTIP.2015.7160996
Filename :
7160996
Link To Document :
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