DocumentCode :
72375
Title :
Electromechanical Diode Cell Scaling for High-Density Nonvolatile Memory
Author :
Hutin, Louis ; Wookhyun Kwon ; Chuang Qian ; Tsu-Jae King Liu
Author_Institution :
Leti, CEA, Grenoble, France
Volume :
61
Issue :
5
fYear :
2014
fDate :
May-14
Firstpage :
1382
Lastpage :
1387
Abstract :
A simple electromechanical diode nonvolatile memory (NVM) cell design was recently proposed and demonstrated to be well suited for implementation in a cross-point memory array architecture. In this paper, a scaling methodology for this new NVM technology is developed with the aid of a calibrated analytical model. A nanoelectromechanical NVM cell (with 20-nm minimum feature size) is projected to operate with voltages below 2 V and sub-1-ns programming time.
Keywords :
nanoelectromechanical devices; random-access storage; cross point memory array; electromechanical diode cell scaling; high density nonvolatile memory; nanoelectromechanical NVM cell; size 20 nm; Analytical models; Computer architecture; Electrostatics; Force; Microprocessors; Nonvolatile memory; Structural beams; Microelectromechanical devices; nonvolatile memory;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2312612
Filename :
6786335
Link To Document :
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