Hammer test to detect BEOL process marginalities on via chains in advanced nodes

In advanced nodes of 28nm and below, inline detection of a process issue inline is very challenging. Inline detection of process marginalities through Characterization Vehicle^® (CV^®), scribe line structures and optical scans are becoming more challenging. With the technology shrink and complex designs, the Characterization Vehicle^® (CV^®) and scribe line structures cannot completely represent the product designs. The optical scans were also less effective compared to past nodes due to the signal-noise ratio. Also the optical scans are effective to detect an issue that happens on the surface of the silicon rather than something buried. This paper discusses a methodology that was able to detect successfully the issue inline saving a lot of time in a manufacturing environment.