Use of simulation studies to overcome key challenges in the fab automation of a 300 mm power semiconductor pilot line comprising thin-wafer processing

Infineon Technologies Dresden establishes the worldwide first highly automated high volume production for power semiconductors based on 300 mm thin wafer technologies. For this special manufacturing platform, there are a lot of challenges for manufacturing and automation. During the research phases in preparation for the future 300 mm pilot lines different simulation studies for wafers, substrates and the existing transportation system are powerful methods to get out the best manufacturing and automation concepts for the future fabs. This article gives an overview of key challenges and shows ways how to overcome the obstacles using innovative manufacturing and automation applications optimized through smart simulation.