Title :
Application of a 3-Step Kaizen Strategy for improvement of WIP flow in a semiconductor fab
Author :
Comulada, Samantha ; Mendola, Justin
Author_Institution :
STG Microelectron., 300-mm Manuf., IBM Corp., East Fishkill, NY, USA
Abstract :
IBM´s 300mm line initiated a program in early 2014 using Kaizen principles to focus on finding small improvements each day to work more efficiently to improve WIP flow and to eliminate MUDA in all processes. This paper will describe the procedures adopted as well as key improvement ideas that were implemented.
Keywords :
semiconductor device manufacture; 3-step Kaizen strategy; IBM; MUDA elimination; WIP flow; semiconductor fab; Conferences; Continuous improvement; Databases; Manufacturing; Probes; Production; Qualifications; gemba; kaizen; lean; manufacturing; team;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
Conference_Location :
Saratoga Springs, NY
DOI :
10.1109/ASMC.2015.7164481
