• DocumentCode
    725138
  • Title

    Application of a 3-Step Kaizen Strategy for improvement of WIP flow in a semiconductor fab

  • Author

    Comulada, Samantha ; Mendola, Justin

  • Author_Institution
    STG Microelectron., 300-mm Manuf., IBM Corp., East Fishkill, NY, USA
  • fYear
    2015
  • fDate
    3-6 May 2015
  • Firstpage
    119
  • Lastpage
    123
  • Abstract
    IBM´s 300mm line initiated a program in early 2014 using Kaizen principles to focus on finding small improvements each day to work more efficiently to improve WIP flow and to eliminate MUDA in all processes. This paper will describe the procedures adopted as well as key improvement ideas that were implemented.
  • Keywords
    semiconductor device manufacture; 3-step Kaizen strategy; IBM; MUDA elimination; WIP flow; semiconductor fab; Conferences; Continuous improvement; Databases; Manufacturing; Probes; Production; Qualifications; gemba; kaizen; lean; manufacturing; team;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2015 26th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • Type

    conf

  • DOI
    10.1109/ASMC.2015.7164481
  • Filename
    7164481
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=725138