Title :
Hybrid Design of Modular Multilevel Converters for HVDC Systems Based on Various Submodule Circuits
Author :
Jiangchao Qin ; Saeedifard, Maryam ; Rockhill, Andrew ; Rui Zhou
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
The modular multilevel converter (MMC) has become the most promising converter technology for high-voltage direct current (HVDC) transmission systems. However, similar to any other voltage-sourced converter-based HVDC system, MMC-HVDC systems with the half-bridge submodules (SMs) lack the capability of handling dc-side short-circuit faults, which are of severe concern for overhead transmission lines. In this paper, two new SM circuit configurations as well as a hybrid design methodology to embed the dc-fault-handling capability in the MMC-HVDC systems are proposed. By combining the features of various SM configurations, the dc-fault current path through the freewheeling diodes is eliminated and the dc-fault current is enforced to zero. Several MMC configurations based on the proposed hybrid design method and various SM circuits, that is, the half-bridge, the full-bridge, the clamp-double, and the five-level cross-connected SMs, as well as the newly proposed unipolar-voltage full-bridge and three-level cross-connected SMs, are investigated and compared in terms of the dc-fault-handing capability, semiconductor power losses, and component requirements. The studies are carried out based on time-domain simulation in the PSCAD/EMTDC software environment for various SM configurations and dc-fault conditions. The reported study results demonstrate the proposed hybrid-designed MMC-HVDC system based on the combination of the half-bridge and the proposed SM circuits is the optimal design among all evaluated systems in terms of the dc-fault-handing capability, semiconductor power losses, and component requirements.
Keywords :
HVDC power convertors; HVDC power transmission; power overhead lines; power transmission faults; short-circuit currents; time-domain analysis; MMC-HVDC systems; PSCAD-EMTDC software environment; SM circuit configurations; component requirements; dc-fault current path; dc-fault-handing capability; dc-fault-handling capability; dc-side short-circuit faults; freewheeling diodes; half-bridge submodules; high voltage direct current transmission systems; hybrid design; modular multilevel converters; overhead transmission lines; semiconductor power loss; three-level cross-connected SM; time-domain simulation; unipolar-voltage full-bridge SM; various submodule circuits; voltage-sourced converter; Capacitors; Circuit breakers; Circuit faults; Design methodology; Fault currents; HVDC transmission; Switches; DC-side short-circuit fault; fault clearance; modular multilevel converter (MMC);
Journal_Title :
Power Delivery, IEEE Transactions on
DOI :
10.1109/TPWRD.2014.2351794