Intel Architecture and Technology for Future HPC System Building Blocks

Summary form only given. Intel Corporation developed several new and enhanced technologies bolstering its leadership in high-performance computing.These new products include the future generation Intel Xeon Phi processor, code-named Knights Hill, and new high-speedinterconnect technology Intel Omni-Path Architecture for HPC. We also provide new software releases and collaborative effortsdesigned to make it easier for the HPC community.During the talk we will disclose details of third-generation Intel Xeon Phi product family, code-named Knights Hill, anddiscuss Intel´s 10nm process technology and integrated Intel Omni-Path Fabric technology. The new Intel Xeon Phi Knights Hillwill follow the upcoming Knights Landing product. The first commercial systems based on Knights Landing expected to beginshipping end of 2015. Intel Omni-Path Architecture is expected to offer 100 Gbps line speed and up to 56 percent lower switchfabric latency in medium-to-large clusters than InfiniBand alternatives. The Intel Omni-Path Architecture will use a 48 port switchchip to deliver greater port density and system scaling compared to the current 36 port InfiniBand alternatives. It will deliver upto 33 percent more nodes per switch chip and also it is expected to reduce the number of switches required, simplifying systemdesign and reducing infrastructure costs at every scale. We believe that new Intel Xeon Phi processor in conjunction with IntelOmni-Path Architecture provide next generation building blocks for Exascale computing.