• DocumentCode
    725676
  • Title

    Value of insulated bus bars in reducing arcing fault duration in low voltage systems

  • Author

    Rajvanshi, Rahul ; Hawkins, Tom

  • Author_Institution
    Siemens Ind., Inc., Grand Prairie, TX, USA
  • fYear
    2015
  • fDate
    14-18 June 2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Power distribution equipment is the backbone of any Industrial process infrastructure. Safety and reliability are the two most important criteria in the proper functioning of the power distribution system. Low voltage switchgear is an important part of power distribution. Minimizing arcing faults in the switchgear is of utmost importance to enable a safe environment. Arcing faults increase the temperatures inside the equipment beyond 20,000 K, rapidly heating air and vaporizing metal parts. This expanding plasma creates severe mechanical and thermal stress in the equipment which can blow open doors and fragment/burn through the enclosure. Arc Resistant Low Voltage Switchgear (LVS) is designed to provide an additional degree of protection for operating personnel performing normal operating duties in close proximity to the equipment. A series of arc flash simulations were performed on Arc Resistant LVS in both Bare Bus (Non-Insulated) and Insulated/Isolated Bus configurations. In all simulations, Insulated/Isolated Bus had significantly shorter arcing duration and lower energy emitted.
  • Keywords
    arcs (electric); busbars; power distribution faults; power distribution protection; switchgear; arc resistant LVS; arcing fault duration reduction; insulated bus bars; low voltage switchgear; low voltage systems; mechanical stress; power distribution equipment; thermal stress; Arc discharges; Circuit faults; Integrated circuit modeling; Low voltage; Resistance; Switchgear; Testing; Arc Resistant; Arc flash hazard; Arcing fault; Bare Bus; Insulated Bus; Isolated Bus; Low Voltage Switchgear;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulp and Paper Industry Conference (PPIC), 2015 61st IEEE
  • Conference_Location
    Milwaukee, WI
  • ISSN
    0190-2172
  • Print_ISBN
    978-1-4799-7113-8
  • Type

    conf

  • DOI
    10.1109/PPIC.2015.7165858
  • Filename
    7165858