DocumentCode :
72582
Title :
An Original Approach Based on Data Exchange Between Car Manufacturers and Suppliers to Estimate Susceptibility Threshold by Numerical Simulation at Early Design Stage
Author :
Chahine, I. ; Bunlon, X. ; Lafon, Frederic ; de Daran, F. ; Matossian, P.
Author_Institution :
Renault Technocentre, Guyancourt, France
Volume :
55
Issue :
2
fYear :
2013
fDate :
Apr-13
Firstpage :
342
Lastpage :
352
Abstract :
This study is a result of a close partnership between a car manufacturer and an automotive component supplier. The aim is to develop electromagnetic compatibility models, i.e., immunity models to predict real-world system failure conditions that can occur inside a vehicle. For the study, we selected an interface that manages air-conditioning inside a vehicle recently put on the market. The system model is submitted by an equipment supplier as a compilation of input impedances and threshold transmitted powers causing a malfunction. The predefined model is then used by a car manufacturer on vehicle-level electromagnetic compatibility simulation, by taking into account the harness configuration and the system placement inside the vehicle cab and chassis. In this paper, we detail the complete method and demonstrate its validity.
Keywords :
automotive components; electromagnetic compatibility; failure analysis; numerical analysis; air-conditioning; automotive component supplier; car manufacturers; car suppliers; data exchange; early design stage; electromagnetic compatibility models; immunity models; numerical simulation; real-world system failure condition prediction; susceptibility threshold estimation; system model; vehicle cab; vehicle chassis; vehicle-level electromagnetic compatibility simulation; Electromagnetic compatibility; Impedance; Integrated circuit modeling; Numerical models; Predictive models; Transmission line measurements; Vehicles; Absorber lined shielded enclosure (ALSE); EMC/EMI modeling; automotive electromagnetic compatibility (EMC); automotive testing; bottom-up approach; bulk current injection (BCI); direct power injection (DPI); numerical simulation; stochasticity;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2012.2221465
Filename :
6357234
Link To Document :
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