Analytical modeling of vertical interconnect in single-ended applications

Despite the shorter physical length and superior electrical properties of the vertical interconnects, the arrangement of corresponding grounding pins drastically affects the characteristic impedance, resulting in impedance mismatch during the propagation of signals, which leads to signal reflection. Therefore, to potentially overcome this disadvantage, this paper endeavors to establish the analytical model of the vertical interconnects for improving the impedance matching in single-ended configurations. The key approach is to use the method of image charges for analyzing the capacitance between the signal pin and grounding pins of the vertical interconnect. The established models are capable of predicting the changes in the capacitance of various grounding pin arrangements in the vertical interconnect, and based on the prediction results the optimal impedance-matching design can be found.