• DocumentCode
    726214
  • Title

    A single-chain multiband reconfigurable linear power amplifier in SOI CMOS

  • Author

    Unha Kim ; Jung-Lin Woo ; Sunghwan Park ; Youngwoo Kwon

  • Author_Institution
    Sch. of EECS, Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2015
  • fDate
    17-22 May 2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A multiband linear CMOS power amplifier (PA) is developed to cover multiple LTE bands from 800 to 2000 MHz using a single PA core. The single-chain PA is based on a two-stage design using stacked-FET cells, and is designed to support any combinations of low/high dual bands out of five popular 3G/4G bands (Band 1/2/4/5/8). To avoid the performance degradation by covering such a wide bandwidth using a single PA-core, the frequency reconfigurability has been applied to the stacked-FET cells, interstage matching as well as the output matching. To further enhance the linearity and efficiency, a phase-based linearizer is employed and reconfigured according to the operating frequencies. W-CDMA test on the fabricated PA shows adjacent channel leakage ratios (ACLRs) better than -39 dBc up to the rated linear power of 28.5 dBm and power-added efficiencies (PAEs) higher than 40.7% and 46% for high- and low- frequency band groups, respectively. Compared with the dedicated PAs using the same process, PAE degradation is limited to 1.6 ~ 3.3%. To our knowledge, this work is among the best results from the single-chain PAs for 3G/4G mobile applications.
  • Keywords
    CMOS integrated circuits; adjacent channel interference; power amplifiers; silicon-on-insulator; SOI CMOS; adjacent channel leakage ratios; interstage matching; multiband linear CMOS power amplifier; phase-based linearizer; single-chain multiband reconfigurable linear power amplifier; stacked-FET cells; CMOS integrated circuits; Indexes; Logic gates; PHEMTs; RNA; CMOS; LTE; SOI; W-CDMA; envelope injection; linearization; multiband; power amplifier (PA); reconfigurable; stacked-FET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium (IMS), 2015 IEEE MTT-S International
  • Conference_Location
    Phoenix, AZ
  • Type

    conf

  • DOI
    10.1109/MWSYM.2015.7167086
  • Filename
    7167086