DocumentCode
726949
Title
Designing silicon carbide NMOS integrated circuits for wide temperature operation
Author
Cheng-Po Chen ; Ghandi, Reza
Author_Institution
Global Res. Center, Gen. Electr., Niskayuna, NY, USA
fYear
2015
fDate
24-27 May 2015
Firstpage
109
Lastpage
112
Abstract
Designing integrated circuits using silicon carbide (SiC) MOSFETs for operation in a wide temperature range brings unique challenges that require a good understanding of device characteristics, careful analysis of device-circuit interactions and a fresh look at what the technology can and cannot do. We describe the available devices in General Electric´s SiC MOSFET-based technology, and use common-source amplifiers as examples in the context of designing a circuit for a wide temperature range from 25 C to 500 C.
Keywords
MOS integrated circuits; MOSFET; amplifiers; silicon compounds; wide band gap semiconductors; GE; MOSFET; NMOS integrated circuit; SiC; common-source amplifier; device-circuit interaction; general electric; silicon carbide; temperature 25 C to 500 C; wide temperature operation; Gain; Logic gates; MOSFET; Resistors; Silicon carbide; Temperature distribution; Temperature sensors; MOSFET; high temperature electronics; silicon carbide;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location
Lisbon
Type
conf
DOI
10.1109/ISCAS.2015.7168582
Filename
7168582
Link To Document