• DocumentCode
    727021
  • Title

    A hardware based low temperature solution for VLSI testing using decompressor side masking

  • Author

    Dutta, Arpita ; Kundu, Subhadip ; Chattopadhyay, Santanu ; Kumar Das, Bijit

  • Author_Institution
    Dept. of E&ECE, Indian Inst. of Technol. Kharagpur, Kharagpur, India
  • fYear
    2015
  • fDate
    24-27 May 2015
  • Firstpage
    637
  • Lastpage
    640
  • Abstract
    The temperature of a block (a region in the chip) depends on both heat generation (caused by power consumption) and heat dissipation among neighbors. Power aware test solutions targeting low power consumption during testing, may not produce an acceptable thermal aware solution. In this paper, a hardware based solution using an AND-OR block between the decompressor and each scan chain, has been utilized to deactivate some scan chains during loading to reduce peak temperature during testing. The proposed schemes require negligible hardware overhead and do not require any special patterns. Experimental results of our proposed approach on ISCAS´89 and ITC´99 benchmark circuits show a good reduction in peak temperature.
  • Keywords
    VLSI; cooling; integrated circuit testing; low-power electronics; masks; AND-OR block; ISCAS´89 benchmark circuits; ITC´99 benchmark circuits; VLSI testing; decompressor side masking; heat dissipation; heat generation; power aware test; thermal aware solution; Circuit faults; Fault detection; Flip-flops; Hardware; Heating; Testing; Very large scale integration; AND-OR block; Decompressor side masking; HotSpot; Scan Cell Clustering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
  • Conference_Location
    Lisbon
  • Type

    conf

  • DOI
    10.1109/ISCAS.2015.7168714
  • Filename
    7168714