DocumentCode
728163
Title
Solution of high dimensional transient Fokker-Planck equations by tensor decomposition
Author
Yifei Sun ; Kumar, Mrinal
Author_Institution
Dept. of Mech. & Aerosp. Eng., Univ. of Florida, Gainesville, FL, USA
fYear
2015
fDate
1-3 July 2015
Firstpage
1475
Lastpage
1480
Abstract
A tensor decomposition approach combined with Chebyshev spectral differentiation is developed to solve the transient Fokker-Planck equation (FPE) in high dimensional cases. This method drastically reduces the degrees of freedom required to maintain accuracy in the approximation as dimensionality increases. The transient solution is sought in a single CANDECOMP/PARAFAC decomposition form for all times by the alternating least squares algorithm. This is accomplished by decoupling the spatial dimensions as well as the separation of temporal domain from spatial domain. As a result, the transient solution is obtained without resorting to expensive time-stepping schemes. In addition, a new approach for imposing the vanishing boundary condition in the tensor product framework is proposed, improving the quality of the approximation. Numerical transient solutions for systems up to 14 dimensional state space are successfully obtained on a regular personal computer to demonstrate the advantages of the proposed method.
Keywords
Chebyshev approximation; Fokker-Planck equation; differentiation; least squares approximations; matrix decomposition; tensors; 14D state space; Chebyshev spectral differentiation; alternating least squares algorithm; high dimensional transient Fokker-Planck equation; numerical transient solution; single CANDECOMP-PARAFAC decomposition form; spatial dimension decoupling; spatial domain; temporal domain; tensor decomposition approach; tensor product framework; transient FPE; vanishing boundary condition; Accuracy; Boundary conditions; Chebyshev approximation; Least squares approximations; Tensile stress; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
American Control Conference (ACC), 2015
Conference_Location
Chicago, IL
Print_ISBN
978-1-4799-8685-9
Type
conf
DOI
10.1109/ACC.2015.7170941
Filename
7170941
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