DocumentCode
728728
Title
Next-generation ferroelectric memories based on FE-HfO2
Author
Mueller, S. ; Slesazeck, S. ; Mikolajick, T. ; Muller, J. ; Polakowski, P. ; Flachowsky, S.
Author_Institution
NaMLab gGmbH, Tech. Univ. Dresden, Dresden, Germany
fYear
2015
fDate
24-27 May 2015
Firstpage
233
Lastpage
236
Abstract
In recent years, and with the discovery of ferroelectricity in hafnium oxide, it was possible to scale down ferroelectric memory cells in both transistor and capacitor configurations. This study reports the latest advances for FE-HfO2-based memory cells and arrays. For the 1T FeFET memory approach, retention in the range of 10 μs up to 104 seconds was measured both after 102 and 104 endurance cycles. At room temperature, memory windows of 0.8 V and 0.7 V were extrapolated to ten years respectively. Moreover, a novel operating scheme for a 1T FeFET AND architecture is presented allowing for true random access operation of the array. With respect to capacitor-based memory cells, high aspect ratio ferroelectric trench capacitors are demonstrated which show proper memory characteristics up to 105 cells in parallel. In order to bring these concepts closer to commercialization, device statistics of larger amounts of memory cells have to be provided. For the first time, the functionality of small FeFET memory arrays is shown and the statistical distribution of memory characteristics is analyzed. We provide evidence that with the proper choice of material composition, device size and operating conditions, the realization of memory products utilizing HfO2-based FeFET arrays seems viable in the future.
Keywords
ferroelectric capacitors; ferroelectric materials; ferroelectric storage; field effect transistors; hafnium compounds; statistical distributions; FeFET AND architecture; FeFET memory arrays; HfO2; capacitor-based memory cells; device size; endurance cycles; ferroelectric field effect transistors; ferroelectric hafnium oxide-based memory arrays; ferroelectric hafnium oxide-based memory cells; high aspect ratio ferroelectric trench capacitors; material composition; memory windows; next-generation ferroelectric memories; statistical distribution; temperature 293 K to 298 K; true random access operation; Capacitors; Ferroelectric films; Hafnium compounds; Logic gates; Nonvolatile memory; Random access memory; Threshold voltage; FE-HfO2 ; FRAM; FeFET; HKMG; memory array;
fLanguage
English
Publisher
ieee
Conference_Titel
Applications of Ferroelectric, International Symposium on Integrated Functionalities and Piezoelectric Force Microscopy Workshop (ISAF/ISIF/PFM), 2015 Joint IEEE International Symposium on the
Conference_Location
Singapore
Type
conf
DOI
10.1109/ISAF.2015.7172714
Filename
7172714
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