DocumentCode
729129
Title
System level interconnect electrical performance characterization
Author
Su, Thonas ; Hsu, Jimmy ; Kai Xiao ; Li, Y.L.
Author_Institution
DEG, Intel Microelectron. Asia Ltd., Taipei, Taiwan
fYear
2015
fDate
26-29 May 2015
Firstpage
12
Lastpage
15
Abstract
In PC/Server industry, simulation process is usually separated into pre-layout and post-layout phase. The pre-layout simulation focus in finding the solution space or choosing a better topology [1], [2]. For post-layout simulation, extracting 3 or 5 pairs of the channel model and conducting the simulation analysis is widely used. However, it requires a basic understanding of the layout. Otherwise the channel which is extracted may not be the best one to represent the worst scenario in the reality. The system level interconnect electrical performance characterization, which can consider a whole interface or even multiple interfaces, become an efficient way, especially estimating the risk of an out-of-guideline design. In this paper, a process with less human interaction is demonstrated. This method can relief the burden in choosing the representative channel from the layout and allow the designer to focus in improving the layout quality in these problematic areas.
Keywords
integrated circuit interconnections; integrated circuit layout; PC/Server industry; human interaction; layout quality; out-of-guideline design; post-layout simulation; pre-layout simulation; representative channel; simulation analysis; system level interconnect electrical performance characterization; Couplings; Crosstalk; Delay effects; Frequency-domain analysis; Layout; Servers; Time-domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2015 Asia-Pacific Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4799-6668-4
Type
conf
DOI
10.1109/APEMC.2015.7175350
Filename
7175350
Link To Document