Dual-striplines design optimizations for minimum crosstalk

Dual-stripline is widely used in the computer systems to save printed circuit board (PCB) cost and achieve more compact form factor. Many design parameters can affect the overall performance of the dual-striplines. In this paper, the optimization of the dual-stripline design is discussed in detail, such as stackup selection, component breakout, etc. Theory analysis as well as Three-Dimensional full-wave modelling results of the inter-layer crosstalk for both single-ended and differential dual-stripline are presented to understand the inter-layer crosstalk. Measurement data from a test board is used to correlate the modeling result. An end-to-end simulation flow is proposed to precisely evaluate the overall crosstalk and full-link performance of a design with dual-stripline.