DocumentCode :
729649
Title :
Design and implementation of fine pitch COB LED display
Author :
Yang, Nick G. M. ; Jin, Gavin S. G. ; Niu, Mike D. Y. ; Gao, Andy G. X. ; Lee, S. W. Ricky
Author_Institution :
HKUST LED-FPD Technol. R&D Center, Foshan, China
fYear :
2013
fDate :
10-12 Nov. 2013
Firstpage :
108
Lastpage :
111
Abstract :
LED displays are widely used in advertisement, transportation, and commercial signages. Conventional LED display modules consist of a LED array assembly and a driving circuit board, inside an external housing. The dot pitch of conventional LED displays is typically 2.0 mm or above, which is relatively coarse. In some applications, such as the screen of personal mobile LED devices, a higher resolution with the dot pitch smaller than <;1.5 mm is needed due to the short viewing distance. Therefore, technologies for implementing fine pitch LED displays are in demand. This paper introduces a new type of LED display with the chip-on-board (COB) technology. The dot pitch of this new type of COB LED display may be reduced to 0.5 mm. The configurations for monochromatic and tricolored display modules are discussed. The reliability studies on the COB LED display are also presented. The results of ball bond shear, wire pull, junction temperature and thermal cycling tests indicate that the fine pitch COB LED display is feasible and reliable.
Keywords :
LED displays; assembling; bonding processes; chip-on-board packaging; colour displays; reliability; screens (display); assembly; ball bond shear; chip-on-board technology; driving circuit board; external housing; fine pitch COB LED display module array; junction temperature; monochromatic display module; personal mobile LED device; reliability; screen; size 0.5 mm; thermal cycling testing; tricolored display module; wire pull; Curing; Light emitting diodes; Packaging; Reliability; Transportation; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-2249-9
Type :
conf
DOI :
10.1109/SSLCHINA.2013.7177325
Filename :
7177325
Link To Document :
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