• DocumentCode
    729655
  • Title

    Thermal transient testing of LEDs: A technique enabling the design and manufacturing of reliable SSL products

  • Author

    Poppe, Andras

  • Author_Institution
    Mech. Anal. Div., MicReD, Mentor Graphics, Budapest, Hungary
  • fYear
    2013
  • fDate
    10-12 Nov. 2013
  • Firstpage
    132
  • Lastpage
    136
  • Abstract
    The reliability, useful operating life time and luminous flux are basically determined by the junction temperature of an LED device, therefore the life time and reliability of the final SSL application (such street lighting luminaire, cars´ head lights, etc) as well. And this temperature is directly proportional to the total junction-to-ambient thermal resistance of the heat-flow path of the LED application. This paper provides an overview of the application possibilities of the thermal transient testing of LEDs (using the latest applicable JEDEC standards) in component level characterization as well as during product design, including options of die attach testing, in-situ TIM testing, during life time testing and luminaire level design and testing.
  • Keywords
    life testing; light emitting diodes; reliability; LED; design; heat-flow path; junction temperature; luminous flux; manufacturing; operating life time; reliable SSL products; thermal transient testing; total junction-to-ambient thermal resistance; Cold plates; Heating; Junctions; Light emitting diodes; Power measurement; Reliability; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-2249-9
  • Type

    conf

  • DOI
    10.1109/SSLCHINA.2013.7177332
  • Filename
    7177332