DocumentCode :
729655
Title :
Thermal transient testing of LEDs: A technique enabling the design and manufacturing of reliable SSL products
Author :
Poppe, Andras
Author_Institution :
Mech. Anal. Div., MicReD, Mentor Graphics, Budapest, Hungary
fYear :
2013
fDate :
10-12 Nov. 2013
Firstpage :
132
Lastpage :
136
Abstract :
The reliability, useful operating life time and luminous flux are basically determined by the junction temperature of an LED device, therefore the life time and reliability of the final SSL application (such street lighting luminaire, cars´ head lights, etc) as well. And this temperature is directly proportional to the total junction-to-ambient thermal resistance of the heat-flow path of the LED application. This paper provides an overview of the application possibilities of the thermal transient testing of LEDs (using the latest applicable JEDEC standards) in component level characterization as well as during product design, including options of die attach testing, in-situ TIM testing, during life time testing and luminaire level design and testing.
Keywords :
life testing; light emitting diodes; reliability; LED; design; heat-flow path; junction temperature; luminous flux; manufacturing; operating life time; reliable SSL products; thermal transient testing; total junction-to-ambient thermal resistance; Cold plates; Heating; Junctions; Light emitting diodes; Power measurement; Reliability; Thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
Conference_Location :
Beijing
Print_ISBN :
978-1-4799-2249-9
Type :
conf
DOI :
10.1109/SSLCHINA.2013.7177332
Filename :
7177332
Link To Document :
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