DocumentCode
729655
Title
Thermal transient testing of LEDs: A technique enabling the design and manufacturing of reliable SSL products
Author
Poppe, Andras
Author_Institution
Mech. Anal. Div., MicReD, Mentor Graphics, Budapest, Hungary
fYear
2013
fDate
10-12 Nov. 2013
Firstpage
132
Lastpage
136
Abstract
The reliability, useful operating life time and luminous flux are basically determined by the junction temperature of an LED device, therefore the life time and reliability of the final SSL application (such street lighting luminaire, cars´ head lights, etc) as well. And this temperature is directly proportional to the total junction-to-ambient thermal resistance of the heat-flow path of the LED application. This paper provides an overview of the application possibilities of the thermal transient testing of LEDs (using the latest applicable JEDEC standards) in component level characterization as well as during product design, including options of die attach testing, in-situ TIM testing, during life time testing and luminaire level design and testing.
Keywords
life testing; light emitting diodes; reliability; LED; design; heat-flow path; junction temperature; luminous flux; manufacturing; operating life time; reliable SSL products; thermal transient testing; total junction-to-ambient thermal resistance; Cold plates; Heating; Junctions; Light emitting diodes; Power measurement; Reliability; Thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
Conference_Location
Beijing
Print_ISBN
978-1-4799-2249-9
Type
conf
DOI
10.1109/SSLCHINA.2013.7177332
Filename
7177332
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