Title :
FreeScup: A novel platform for assisting sculpture pose design
Author :
Yirui Wu ; Tong Lu ; Zehuan Yuan ; Hao Wang
Author_Institution :
Nat. Key Lab. for Novel Software Technol., Nanjing Univ., Nanjing, China
fDate :
June 29 2015-July 3 2015
Abstract :
Sculpture design is challenging due to its inherent difficulty in characterizing an artwork quantitatively, and few works have been done to assist sculpture design. We present a novel platform to help sculptors in two stages, comprising automatic sculpture reconstruction and free spectral-based sculpture pose editing. During sculpture reconstruction, we co-segment a sculpture from real scene images of different views through a two-label MRF framework, aiming at performing sculpture reconstruction efficiently. During sculpture pose editing, we automatically extract candidate editing points on the sculpture by searching in the spectrums of Laplacian operator. After manually mapping body joints of a sculptor to particular editing points, we further construct a global Laplacian-based linear system by adopting the spectrums of Laplacian operator and using Kinect captured body motions for real time pose editing. The constructed system thus allows the sculptor to freely edit different kinds of sculpture artworks through Kinect. Experimental results demonstrate that our platform successfully assists sculptors in real-time pose editing.
Keywords :
art; feature extraction; image reconstruction; image segmentation; FreeScup; Kinect captured body motions; Laplacian operator spectrums; automatic sculpture reconstruction; body joint mapping; candidate editing point extraction; free spectral-based sculpture pose editing; global Laplacian-based linear system; real scene images; sculpture artworks; sculpture co-segment; sculpture pose design; two-label MRF framework; Geometry; Image reconstruction; Joints; Laplace equations; Real-time systems; Shape; Three-dimensional displays; FreeScup; Sculpture design; pose editing;
Conference_Titel :
Multimedia and Expo (ICME), 2015 IEEE International Conference on
Conference_Location :
Turin
DOI :
10.1109/ICME.2015.7177421