Title :
Post-processing to reduce missing wedge effect using total variation minimization
Author :
Kyung-Chan Jin ; Yun-Ho Song ; Geun-Hee Kim
Author_Institution :
Manuf. Syst., Korea Inst. of Ind. Tech., Choenan, South Korea
Abstract :
The use of X-ray inspection for analyzing faults in printed circuit board components is becoming more important with the ongoing development of 3D integrated circuits. Achieving optimal X-ray inspection for a slab-like flat object depends on selecting an appropriate computed tomography (CT) geometry, such as an off-centered cone-beam geometry. However, because the use of flat components in tomographic reconstruction restricts the range of viewing angles, CT leads to the missing wedge problem, which causes missing angle artifacts in reconstructed 3D data. In this paper, we propose the use of post-processing to reduce the missing wedge effect via total variation minimization, when sinogram images have equal quality at all viewing angles and the accessible tilt range is restricted only by the physical limits of the oblique-view CT system. We demonstrate that axial slice reconstruction using the proposed processing method substantially reduces the missing wedge effect and that the proposed method provides overall image quality superior to that achieved with existing denoising methods.
Keywords :
X-ray imaging; automatic optical inspection; computerised tomography; image denoising; image reconstruction; printed circuits; three-dimensional integrated circuits; 3D integrated circuits; CT geometry; axial slice reconstruction; computed tomography; denoising methods; image quality; missing angle artifacts; missing wedge effect; oblique-view CT system; off-centered cone-beam geometry; optimal X-ray inspection; post-processing; printed circuit board components; reconstructed 3D data; sinogram images; slab-like flat object; tomographic reconstruction; total variation minimization; Consumer electronics; 3D Integrated Circuit; Computed Tomography; Denoising; Image Enhancement; Missing Wedge; Tomographic Reconstruction;
Conference_Titel :
Consumer Electronics (ISCE), 2015 IEEE International Symposium on
Conference_Location :
Madrid
DOI :
10.1109/ISCE.2015.7177787