DocumentCode :
73011
Title :
Application-Specific Wear Leveling for Extending Lifetime of Phase Change Memory in Embedded Systems
Author :
Duo Liu ; Tianzheng Wang ; Yi Wang ; Zili Shao ; Qingfeng Zhuge ; Sha, Edwin H-M
Author_Institution :
Coll. of Comput. Sci., Chongqing Univ., Chongqing, China
Volume :
33
Issue :
10
fYear :
2014
fDate :
Oct. 2014
Firstpage :
1450
Lastpage :
1462
Abstract :
Phase change memory (PCM) has been proposed to replace NOR flash and DRAM in embedded systems because of its attractive features. However, the endurance of PCM greatly limits its adoption in embedded systems. As most embedded systems are application-oriented, we can tackle the endurance problem of PCM by exploring application-specific features such as fixed access patterns and update frequencies. In this paper, we propose an application-specific wear leveling technique, called Curling-PCM, to evenly distribute write activities across the whole PCM chip to improve the endurance of PCM in embedded systems. The basic idea is to exploit application-specific features in embedded systems and periodically move the hot region across the whole PCM chip. To reduce the overhead of moving the hot region and improve the performance of PCM-based embedded systems, a fine-grained partial wear leveling policy is proposed for Curling-PCM, by which only part of the hot region is moved during each request handling period. Experimental results show that Curling-PCM can effectively evenly distribute write traffic for a prime application of PCM in embedded systems. We expect this paper can serve as a first step toward the full exploration of application-specific features in PCM-based embedded systems.
Keywords :
application specific integrated circuits; embedded systems; phase change memories; Curling-PCM; DRAM; NOR flash; application-specific wear leveling technique; embedded system; fine-grained partial wear leveling policy; fixed access pattern; overhead reduction; phase change memory lifetime extension; request handling period; write traffic distribution; Ash; Computer architecture; Embedded systems; Equations; Microprocessors; Phase change materials; Random access memory; Application specific; endurance; phase change memory; wear leveling; write activity reduction;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2014.2341922
Filename :
6899774
Link To Document :
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