• DocumentCode
    73077
  • Title

    Maximizing Yield per Area of Highly Parallel CMPs Using Hardware Redundancy

  • Author

    Da Cheng ; Gupta, Suneet K.

  • Author_Institution
    Univ. of Southern California, Los Angeles, CA, USA
  • Volume
    33
  • Issue
    10
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1545
  • Lastpage
    1558
  • Abstract
    The manufacturing yield of chip multiprocessors (CMPs) has become a significant problem as more transistors are integrated onto a single die and the defect rate keeps increasing for “end-of-Moore” nano-scale CMOS technologies. Since such CMP designs usually have significant structural symmetry, adding spare copies to these should be an effective method for increasing yield per area, as is the case for memories. However, a systematic approach to add spare copies to optimize CMP yield per area has never been developed, primarily due to the lack of: 1) a general model of CMP architectures and 2) a practically-useable model for computing areas of chip versions with different configurations of spare copies. This paper develops such models and, in conjunction with a systematic approach for enumerating a wide range of spare configurations, uses these to compute the area overhead and yield for each configuration. In particular, this paper proposes a general spare cores sharing technique to maximize yield per area of any CMP by efficiently traversing the design space for adding spare cores. Experimental results show that the advantage of the proposed approach over traditional approaches increases with continued technology scaling. Specifically, the proposed approach achieves (2times ) yields per area over previous approaches for 32 nm and 22 nm technologies. Also, the obtained yield per area values provided by our approach are around 70% of that obtained for the ideal scenario where defect density is zero and no redundancy is added.
  • Keywords
    CMOS integrated circuits; integrated circuit design; integrated circuit manufacture; integrated circuit reliability; microprocessor chips; multiprocessing systems; redundancy; CMP designs; chip multiprocessor manufacturing yield; end-of-Moore nano-scale CMOS technology; general spare core sharing technique; hardware redundancy; highly parallel CMPs; size 22 nm; size 32 nm; structural symmetry; systematic approach; technology scaling; transistors; yield per area maximization; Computational modeling; Computer architecture; Hardware; Program processors; Redundancy; Systematics; Topology; Design for tolerance; scope of sharing; spare cores; yield per area;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2014.2334298
  • Filename
    6899783