DocumentCode :
731701
Title :
Flipped CMOS-diaphragm capacitive tactile sensor surface mountable on flexible and stretchable bus line
Author :
Asano, S. ; Muroyama, M. ; Bartley, T. ; Kojima, T. ; Nakayama, T. ; Yamaguchi, U. ; Yamada, H. ; Nonomura, Y. ; Hata, Y. ; Funabashi, H. ; Tanaka, S.
Author_Institution :
Tohoku Univ., Sendai, Japan
fYear :
2015
fDate :
21-25 June 2015
Firstpage :
97
Lastpage :
100
Abstract :
The following novel configuration has been developed for a MEMS-CMOS integrated tactile sensor on a flexible and stretchable bus for covering a social robot body: a sensing diaphragm is formed on a CMOS substrate by backside etching, and the CMOS substrate is flip-bonded to a low temperature co-fired ceramic (LTCC) substrate. By this configuration, no through-silicon vias (TSVs) are needed, simplifying the fabrication process. The flipped CMOS substrate and the LTCC substrate were bonded and electrically connected using Au-Au bonding, which also formed differential capacitive gaps. A flexible and stretchable wire was fabricated by metal etching and polyimide laser cutting. The tactile sensors, which were mounted on the surface of the flexible bus, sent coded digital signals according to applied force.
Keywords :
CMOS integrated circuits; capacitance measurement; capacitive sensors; ceramics; diaphragms; etching; integrated circuit bonding; laser beam cutting; microfabrication; microsensors; surface mount technology; tactile sensors; wires (electric); Au-Au bonding; LTCC substrate; MEMS-CMOS integrated tactile sensor; TSV; backside etching; flexible bus line; flexible wire; flip-bonding; flipped CMOS-diaphragm capacitive tactile sensor; metal etching; polyimide laser cutting; social robot body; stretchable bus line; stretchable wire; surface mounting technology; temperature cofired ceramic substrate; through-silicon vias; CMOS integrated circuits; Electrodes; Gold; Substrates; Tactile sensors; Au-Au bonding; MEMS-CMOS integration; Stretchable wire; Surface mounting; Tactile sensor; Wafer-level packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2015 Transducers - 2015 18th International Conference on
Conference_Location :
Anchorage, AK
Type :
conf
DOI :
10.1109/TRANSDUCERS.2015.7180870
Filename :
7180870
Link To Document :
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