Capacitive sensor fusion: Co-fabricated X/Y and Z-axis accelerometers, pressure sensor, thermometer

This paper presents a capacitive X/Y and Z-axis accelerometer, pressure sensor, and resonant thermometer, co-fabricated in a single die using an ultra-clean, high-temperature, wafer-scale, production-compatible encapsulation process. This process is free of bond rings and getter areas, thereby reducing overall die size to a minimum. Utilizing a process that allows for nitride and silicon etch stops, we show that it is possible to design high-sensitivity pressure sensors and accelerometers with very little cross-sensitivity. In addition, remaining sensitivities to environmental effects, such as temperature, can be compensated to reveal a suite of on-chip high-performance sensors that is accurate over temperature. All of this is accomplished in a process similar to current high-volume production processes in industry.